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Si-homoepitaxy by electron cyclotron resonance CVD

机译:Si-Homoepitaxy通过电子回旋谐振CVD

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Low-temperature homoepitaxy of silicon has been achieved at T=450/spl deg/C by using electron cyclotron resonance CVD (2.45 GHz, up to 1.5 kW). H/sub 2/ and H/sub 2//Ar were used as excitation gases and either SiH/sub 4/ or mixtures of SiH/sub 4/ with PH/sub 3//H/sub 2/ or B/sub 2/H/sub 6//H/sub 2/ served as process gas. The epitaxial layers were grown with a thickness of up to 3 /spl mu/m at a rate of up to 25 nm/min. Highly phosphorus-doped epitaxial layers were used as emitters in 2/spl times/2 cm/sup 2/ solar cell structures on p-type FZ- and SILSO-wafers as base material. These cells had AM1.5 efficiencies of up to 15% and 11%, respectively. The results suggest that recombination at the base-emitter interface is a limiting factor.
机译:通过使用电子回旋谐振CVD(2.45GHz,高达1.5 kW),在T = 450 / SPL DEG / C处实现了低温主典。 H / sub 2 /和h / sub 2 // Ar被用作激发气体和SiH / sub 4 /或SiH / sub 4 /带pH / sub 3 // h / sub 2 /或b / sub 2的混合物/ h / sub 6 // h / sub 2 /用作过程气体。将外延层生长,厚度高达3 / SPL mu / m,其速率高达25nm / min。在P型FZ和硅晶醚上用作2 / SPL时/ 2cm / sup 2 /太阳能电池结构的发射器作为基础材料的高磷掺杂外延层。这些细胞分别具有高达15%和11%的效率。结果表明,基极发射器接口的重组是限制因素。

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