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Shear stresses in a stepped bonded repair of a laminate

机译:在层压板的阶梯式粘合修复中剪切应力

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This paper presents a simplified model for the determination of the shear stress distribution inside a stepped repair of a thin laminated structure. The shear stresses are derived concerning the special material properties of a laminate likenon-isotropic material behaviour, differences of the material properties in thickness direction etc. Assuming the laps to be a quasi-homogeneous structure, the bond-line is treated as inhomogeneity, which transfers the load via shear stresses from parentlaminate into patch and vice versa. The shear stresses in radial and tangential direction and also in-plane shear stresses are derived with help of the proposed model. The model allows a straightforward calculation of the stress distribution without muchcalculation effort. The efficiency of the model is shown by comparison of example calculations with FE-calculations performed with the FE-system ANSYS.
机译:本文呈现了一种简化模型,用于确定薄型层叠结构的阶梯修复内部的剪切应力分布。剪切应力源于层压磷酸根 - 各向同性材料行为的特殊材料特性,厚度方向等材料特性的差异假设圈是准均匀的结构,键合线被视为不均匀性,这通过母素酸盐的剪切应力将负载转移到贴片中,反之亦然。利用所提出的模型的帮助,推导出径向和切向方向上的剪切应力以及面内剪切应力。该模型允许直接计算应力分布而无需多宏计算。通过使用FE系统ANSYS执行FE-CALLATION比较示例计算来示出模型的效率。

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