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1000/spl deg/C operation of diamond Schottky diode

机译:钻石肖特基二极管1000 / SPL DEG / C操作

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Summary form only given. Due to the bandgap energy of 5.45 eV, the diamond intrinsic carrier concentration is 10/sup 10/cm/sup -3/ at 1000/spl deg/C. This is a density found in Si at room temperature and similar device performance may be expected. On the other hand, a number of materials and fabrication difficulties have prevented such a demonstration up to now. The Schottky materials system presented here consisted of a chemically stabilized highly doped (quasi-metallic) Si interfacial layer to diamond, a nitrogen stuffed sputter deposited Si:W alloy and an Au overlap. The (W:Si)N diffusion barrier limited the use of the Au overlay to approximately 800/spl deg/C. Without this overlayer operation up to 1000/spl deg/C could be demonstrated. At 1000/spl deg/C breakdown was observed at 30 V. However, similar devices have shown breakdown voltages up to 150 V at room temperature. A rectification ratio of Ion/Ioff=10 is maintained. To the authors knowledge this is the first demonstration of Schottky barrier operation at very high temperatures.
机译:摘要表格仅给出。由于5.45eV的带隙能量,金刚石内在载体浓度为10 / sp10 / cm / sup -3 /适nin 1000 / spl deg / c。这是在室温下在SI中发现的密度,并且可以预期类似的设备性能。另一方面,许多材料和制造困难已经阻止了现在的演示。这里介绍的肖特基材料系统由化学稳定的高掺杂(准金属)Si界面层组成为金刚石,氮填充溅射沉积Si:W合金和Au重叠。 (w:si)n扩散屏障限制使用Au覆盖层至大约800 / spl deg / c。如果没有该重叠操作,可以证明高达1000 / SPL DEG / C的操作。在30V下观察到1000 / SPL DEG / C分解。然而,类似的器件在室温下显示了高达150 V的击穿电压。保持离子/ IOFF = 10的整流比。向作者知识,这是肖特基障碍在非常高的温度下的第一次演示。

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