Development of solderless joining technologies using conductive adhesives

摘要

Solderless joining technique using a new Ni-type conductive adhesives was developedFirstly, electrical performance was evaluated using a practical module. Delay time and output voltage of a HIC module assembled by the conductive adhesive were equivalent to standard eutectic solder.Secondly, joining reliability was examined using area array package. No electro-migration was observed at any joint in Temperature Humidity Bias (THB) test (85°C, 85%RH, DC5V, 1000h). Ceramic Chip Scale Package (CSP-C) mounted on FR-4 mother board usingthis conductive adhesive showed 5 times longer lifetime than standard eutectic solder in temperature cycling test (-40 to 125°C). Additional extension of lifetime was succeeded through changing packaging structure.