Using e-Manufacturing to Improve Fab Productivity

摘要

As fabs migrate to 300mm wafers the pressure to significantly improve factoryrnproductivity remains intense. Productivity improvements due to larger wafer sizes,rnsmaller device feature sizes, and yields of greater than 90% yields, are now assumed.rnThe only area currently remaining where significant productivity improvements can bernmade is equipment utilization improvement and scrap prevention. The goal ofrnInternational SEMATECH's e-Manufacturing program is to accelerate these productivityrnimprovements using data-driven, real-time, automated, decision-making. ISMT's e-rnManufacturing program approach, progress to date, and plans will be described.rnAccess to manufacturing equipment data is the critical starting point for e-Manufacturing.rnThe ability to obtain near real-time equipment, process, health monitoring, metrology,rnand yield data is absolutely essential for e-Manufacturing to work. This data is beingrnused inside the fab using software applications such as run-to-run control, fault detectionrnand classification, predictive and preventative maintenance, yield management andrnprediction, and real-time product and equipment scheduling. This same data is alsornbeing used by equipment suppliers to monitor their equipment's performance, diagnosernimpending problems before the equipment requires repair, classify equipment faults,rnrecommend the required preventative maintenance, and verify that the repairs wererneffective.rnConnecting these systems so they all work together is challenging, but ultimatelyrnnecessary. An industry-wide strategy is provided to accelerate the adoption of a set ofrncommon guidelines, user requirements, and standard interfaces for all the componentsrnof the overall fab data systems.rnInterface software standards are maturing supporting quick implementations of thesernsystems at low cost. The use of existing mainstream computing standards and Internetrnstandards is accelerating this migration and reducing integration costs. The currentrnstatus of the SEMI standards activity will be reviewed. Data Quality, Equipment DatarnAcquisition Interfaces, and e-Diagnostics Interfaces will all be presented.