Distributed Thermal Management Systems for the Integrated Electronic and Thermal Design of Avionics

摘要

An architecture for thermal management of avionics and electronics systems based on integrated electronics and thermal design at the PCB board level is introduced. Advantages of this approach include the reduction of the number of external components that are required in relation to existing approaches to advanced liquid-based thermal management techniques along with other gains in efficiency due to the PCB board-level adaptivity that is embedded in this design solution. In addition, this type of system can potentially be implemented as a sealed self-contained solution that will allow maintenance personnel to avoid dealing to hazardous cooling compounds as part of the system maintenance procedures.