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Wide bandgap semiconductor electronic devices for high frequency applications

机译:用于高频应用的宽带隙半导体电子设备

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The microwave performance of electronic devices fabricated from SiC and GaN is described. The investigation makes use of theoretical simulations and the results are compared to experimental measurements. Excellent agreement between the simulated and measured data is obtained. It is demonstrated that microwave power amplifiers fabricated from SiC and GaN based semiconductors offer superior RF power performance, particularly at elevated temperature compared to comparable components fabricated from GaAs MESFET's. In particular, room temperature RF output power on the order of 4 W/mm with power-added efficiency approaching the ideal values for class A and B operation is available. These devices are likely to find application in power amplifiers for base station transmitters for cellular telephone systems, power modules for phased-array radars, and other applications. The devices are particularly attractive for applications that require operation at elevated temperature.
机译:描述了由SiC和GaN制造的电子设备的微波性能。调查利用理论模拟,结果与实验测量相比。获得模拟和测量数据之间的良好协议。据证明,由SiC和GaN的半导体制造的微波功率放大器提供优异的RF功率性能,特别是与GaAs Mesfeet制造的可比部件相比的高温。特别是,室温RF输出功率为4个W / mm,具有接近A类和B个操作的理想值的电力增加效率。这些设备可能在用于蜂窝电话系统的基站发射机的功率放大器中找到应用,用于相控阵雷达的电源模块以及其他应用。该器件对于在升高温度下需要操作的应用特别有吸引力。

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