3D thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

摘要

This paper recalls how the two-port network theory can be extended to 3D conductive heat transfer in multi-layered plane structures. It is shown how efficient computation tools can be built up by implementing this theory with the help of FFT algorithms. These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration of the thermal analysis of an IGBT power module is also given.