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A new fabrication method of silicon field emitter array with local oxidation of polysilicon and chemical-mechanical-polishing

机译:具有局部氧化多晶硅和化学机械抛光的硅场发射器阵列的新制造方法

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摘要

In this paper, we describe the fabrication of single crystal silicon field emitter arrays. Emission tips have been fabricated by a novel method which uses chemical-mechanical-polishing (CMP) and local polysilicon oxidation for gate electrodes and gate dielectrics, respectively. By this method, we can shrink the radius of gate aperture without increasing gate leakage current, and get a clean cut edge of gate electrode. The anode emission current measured from the 1024 tips array was about 17 /spl mu/A (16 nA/tip) at a gate voltage of 64 V.
机译:在本文中,我们描述了单晶硅场发射器阵列的制造。发射尖端由一种新的方法制造,该方法分别使用化学机械抛光(CMP)和局部多晶硅氧化用于栅电极和栅极电介质。通过这种方法,我们可以在不增加栅极漏电流的情况下缩小栅极光圈的半径,并获得栅电极的干净切割边缘。从1024尖端阵列测量的阳极发射电流在64V的栅极电压下约为17 / SPL MU / A(16A /尖端)。

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