A single-chip 26 million transistor digital processing subsystem is in the final stages of development. This general purpose device can be used as a stand-alone processor or as a building block for both SIMD and MIMD processor arrays. This 120 MFLOPS peak 1.75 watt chip, with 512 k-bytes of on-chip SRAM and sophisticated communications capabilities, requires no glue chips to form processors arrays. This paper describes the physical and functional features of the integrated circuit, and outlines its application potential.
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