Large arrays of bolometer elements have considerable potential for thermal imaging applications, offering uncooled operation, and a performance which challenges the cooled semiconductor detectors. A hybrid array technology, exploiting ferroelectric materials, is the basis of a successful range of linear and 2-D arrays. The success is based on hot-pressed ceramics (operating in both pyroelectric and dielectric modes), and the technologies for solder bump bonding and element reticulation. Arrays are increasing in size, from 10$+4$/ elements up to 10$+5$/ elements while the pitch is reducing, thus providing high resolution in compact systems. Ferroelectric thin films have recently shown marked improvement in the merit figures and, if compatible with the silicon IC, will allow a more direct array fabrication. These integrated array technologies have potential for high yield and low cost in very large area devices.
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