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3D Interconnection by FIB Assisted Pt Deposition and Electroless Nickel Deposition on the Sides and Edges of an I-Seed

机译：3D通过FIB辅助PT沉积和化学镀镍沉积在I-Seai的侧面和边缘上

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《Electronic Components and Technology Conference》|2006年||共4页
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Razeeb K.M.; Nagle L.; Barton J.; Tassie P.; OFlynn B.; Rohan J.; OMathuna C.;
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中图分类自动化技术、计算机技术;
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入库时间 2022-08-20 19:43:43

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2. Microcellular 3D graphene foam via chemical vapor deposition of electroless plated nickel foam templates [J] . Jiang Wei, Xin Hao, Li Wei Materials Letters . 2016,第JANa1期

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3. Electroless Nickel Alloy Deposition on SiO_2 for Application as a Diffusion Barrier and Seed Layer in 3D Copper Interconnect Technology [J] . Tae-Yoo Kim, Hwa-Jin Son, Seung-Kyu Lim, Journal of nanoscience and nanotechnology . 2014,第12期

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4. 3D Interconnection by FIB Assisted Pt Deposition and Electroless Nickel Deposition on the Sides and Edges of an I-Seed [C] . Razeeb K.M., Nagle L., Barton J., Electronic Components and Technology Conference, 2006. Proceedings. 56th . 2006

机译：FIB辅助在I种子侧面和边缘上进行Pt沉积和化学镍沉积的3D互连
5. Hardness characteristics of cobalt/chromium and nickel/chromium by electrodeposition or electroless deposition. [D] . Chen, Wei. 2005

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6. Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells [O] . Shu Huei Hsieh, Jhong Min Hsieh, Wen Jauh Chen, 2017

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3D Interconnection by FIB Assisted Pt Deposition and Electroless Nickel Deposition on the Sides and Edges of an I-Seed

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