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From (Integrated) Circuits to Systems of Systems on Chip in Five Decades: How did and will (IC) Test Technology keep up?

机译:从(集成)电路到五十年来芯片系统系统:如何和将(IC)测试技术继续追随?

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The past five decades amount to mind boggling progress in IC design and manufacturing technology. In this period, we have gone from the inception of ICs to now what literally amounts to the integration of systems of systems on chip. Whereas experts debate the continued evolution of ICs according to Moore's Law beyond the next decade, the advent of the complex integration of multi-physics systems is just in its infancy and is predicted to grow exponentially in the coming years. Designing and manufacturing complex ICs is of course a feat in itself. Testing and testability has often been taken for granted as a necessary (not to say evil) requirement. But who wants of an IC that cannot be duly tested, to ensure quality and reliability, especially when deployed in life-critical applications? Test technology, along with design technology has had to make enormous and rapid progress over the past half-century. Here, we highlight some of the key elements of IC test technology. We briefly mention some directions and challenges and opportunities for test technology in the near future, especially as multi-physics integrated systems of systems continue to emerge and progress on the volume production curves.
机译:过去五十年来介意IC设计和制造技术中的令人难以置信的进展。在此期间,我们已经从IC开始到现在,芯片上系统系统的集成才能完成。虽然专家辩论了摩尔法在未来十年的摩尔定法的持续发展,多物理系统复杂集成的出现就在其初期,预计未来几年将以指数呈指数级增长。设计和制造复杂IC当然是一个壮举。测试和可测试性通常被视为必要的(不是说邪恶)的要求。但谁想要一个不能正式测试的IC,以确保质量和可靠性,特别是在部署在生活关键型应用程序中?测试技术以及设计技术必须在过去的半个世纪中取得巨大和快速进展。在这里,我们突出了IC测试技术的一些关键要素。在不久的将来,我们简要介绍一些方向和挑战和测试技术的机遇,特别是由于系统的多物理集成系统继续出现并在卷生产曲线上取得进展。

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