Current Developments in Precious Metal Plating for the Connector Market

摘要

Precious metal plating as a technology has been around for more than 100 [1] years. Its use in the Electronic Market for Interconnection has been well documented and the processes used well proven. The demands though for smaller, lighter, faster and "cheaper" components moves forward relentlessly. Precious metal plating has and will always have a major role in achieving these demands. However at the same time there are pressures being brought upon both suppliers and users of these plating processes to meet new environmental and ethical compliance standards as well new legislation and costs. How the precious metal plating market is coping with these demands will be the subject of this paper and presentation. Traditionally Gold and Silver have been the metals most used for connectors! However in recent years the advances with Palladium Nickel plating has also given alternative, cost effective and environmental benefits. The implication on the deposit qualities will be explained as well as the innovative alternative process chemistries particularly in these Gold, Palladium/Nickel and Silver plating which will be discussed. How plant and equipment has developed to enable these superior chemistries to function will also be shown.