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Dielectric properties of plasma polymerized thin films of tetramethylsilane and ammonia

机译:四甲基硅烷和氨的等离子体聚合薄膜的介电性能

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Films produced by plasma deposition of a mixture of tetramethylsilane (TMS) and ammonia (NH/sub 3/) at different substrate temperatures were studied. The intent was to produce films comprising organo-silicon polymers with inorganic-type silicon nitride. Measurements of the rate of deposition, composition, structure and electrical properties (over a wide range of frequency) of films deposited at various temperatures are reported and discussed. Parameters such as flow rates, RF power, and position of the substrate were held constant. An attempt is made to correlate the electrical properties with the composition.
机译:研究了通过等离子体沉积在不同底物温度下血浆沉积的膜沉积的薄膜沉积的蒸氨甲硅烷(TMS)和氨(NH / SUB 3 /)。意图是生产包含有机硅聚合物的薄膜,具有无机型氮化硅。报道并讨论了沉积在各种温度下沉积的沉积物的沉积,组成,结构和电性能(在宽范围频率范围内)的测量。诸如流速,RF功率和基板的位置的参数保持恒定。尝试将电性能与组合物相关联。

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