A 3.5 W HBT MMIC power amplifier module for mobile communications

摘要

A 900 MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AlN package as the MMIC chip carrier. The power module gave a peak output power of 3.7 W and a power-added efficiency of 54.5% with a +6 V single supply voltage.