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Rectification failure in GaAs MESFETs subjected to single pulses of intense microwave radiation

机译:GaAs Mesfet中的整流失败受到强烈微波辐射的单个脉冲

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An important mechanism for damage to GaAs microwave integrated circuits from single pulses of intense microwave radiation has been observed by the use of high-speed photography and optical and RF spectroscopy. This mechanism is named rectification failure because it transforms the Schottky junctions of the transistors to ohmic resistors. High-speed photography was used to clock the emission of optical radiation after the arrival of the high-power microwave pulse, optical spectroscopy was employed to determine the source of the optical emissions, and RF spectroscopy was applied to monitor the generation of harmonics of the incident radiation as a function of time during each test pulse. Devices tested included packaged low-noise amplifiers and power amplifiers. The tests proceeded by the direct injection of a single pulse of microwave radiation into the input port of the device. The pulses typically lasted for 100 ns. Testing would start at power levels too low to inflict damage and would proceed with successively higher power pulses until damage was observed. Devices were tested both with and without bias voltages applied. The results of the testing are presented.
机译:通过使用高速摄影和光学和射频光谱,已经观察到来自强烈微波辐射的单脉冲GaAs微波集成电路的重要机制。这种机制被命名为整流失败,因为它将晶体管的肖特基结转换为欧姆电阻器。高速摄影用于在高功率微波脉冲到达后时钟发射光学辐射,采用光学光谱来确定光学发射源,并应用RF光谱来监测谐波的产生在每个测试脉冲期间发生入射辐射作为时间的函数。测试设备包括封装的低噪声放大器和功率放大器。测试通过直接喷射单个微波辐射的单个脉冲进入装置的输入端口。脉冲通常持续100ns。测试将从功率水平开始太低而无法造成损坏,并且会继续前续更高的功率脉冲,直到观察到损坏。使用施加的偏置电压测试设备。呈现测试结果。

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