首页> 外文会议>IEEE International Conference on Embedded Software and Systems >An Adaptive Slicing Thickness Adjustment Method Based on Cloud Point in 3D Printing
【24h】

An Adaptive Slicing Thickness Adjustment Method Based on Cloud Point in 3D Printing

机译:基于云点的3D打印自适应切片厚度调节方法

获取原文

摘要

This paper introduces an approach for slicing thickness adaptively based on cloud point that aims at the problem of a large amount of data, inefficiency and low precision of 3D printing. The proposed method can select the optimum slicing thickness adaptively based on error analysis of point cloud belt in unified slicing direction by adopting the optimizing quadtree structure of point cloud to store point cloud data. In view of the different complexity model to evaluate the experiment. The result demonstrates that the computational complexity of proposed method decreased by 30% compared with method II. It is suitable for elaborate model of layered manufacturing printing.
机译:本文介绍了一种基于浊点的自适应切割厚度的方法,该浊点旨在瞄准大量数据的问题,低效率低,3D打印精度低。通过采用Point云的优化云结构来存储点云数据,所提出的方法可以基于统一切片方向的点云带的误差分析,自适应地选择最佳切片厚度。鉴于评估实验的不同复杂性模型。结果表明,与方法II相比,所提出的方法的计算复杂性降低了30%。它适用于分层制造印刷模型。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号