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Electrodeposited High Strength Au-TiO2 Nano Composite Film for MEMS Devices

机译:用于MEMS器件的电沉积高强度Au-TiO2纳米复合膜

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In this study, high strength Au-based composited films was achieved through TiO_2 nanoparticles (NPs) reinforcement . The Au-TiO_2 composite film was electrodeposited onto a copper plate with a 1 cm~2 surface area using galvanostatic method. Different surface morphologies of composite films with different TiO_2 contents were observed through scanning electron microscope (SE4300, Hitachi) images (shown in Figure 1). The surfaces were found to be composed of particles, and a decrease in the particle size was observed with an increase in amounts of TiO_2 in the film from 0 to 2.72 wt%. Broadened XRD peaks of the Au-TiO_2 composite film containing 2.72 wt% TiO_2 shown in Figure 2 indicated grain refinement caused by co-deposition with the NPs. The primary characteristic peak of TiO_2 at 2θ = 25.1° also appeared in the XRD patterns of the Au-TiO_2 composite film containing 2.72 wt% TiO_2 NPs (inset of Figure 2). Figure 3 shows the scanning ion microscope (SIM, FB-2100, Hitachi) images and a stress-strain curve of a micro-pillar fabricated from the composite film containing 2.72 wt% TiO_2 NPs. Yield strength of the pillar was 0.84 GPa, which was much higher than that of pure gold electroplated through conventional method .
机译:在该研究中,通过TiO_2纳米颗粒(NPS)增强来实现高强度Au基复合膜。使用Galvanostatic方法将Au-TiO_2复合膜用1cm〜2表面积电沉积在铜板上。通过扫描电子显微镜(SE4300,HITACHI)图像观察具有不同TiO_2内容物的复合膜的不同表面形态(如图1所示)。发现表面由颗粒组成,并且观察到粒度的降低,其中薄膜中的TiO_2的量增加到0-2.72wt%。扩大含有2.72wt%TiO_2的Au-TiO_2复合膜的XRD峰,如图2所示,指示由与NPS共沉积引起的晶粒细化。在含有2.72wt%TiO_2 NPS(图2的插图)的Au-TiO_2复合膜的XRD图案中也出现了TiO_2的主要特征峰。图3示出了扫描离子显微镜(SIM,FB-2100,HITACHI)图像和由含有2.72wt%TiO_2 NPS的复合膜制成的微支柱的应力 - 应变曲线。柱的屈服强度为0.84GPa,远高于通过常规方法电镀的纯金。

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