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Ka-Band Dual Input Stacked 22 nm CMOS FDSOI Power Amplifier with Transformer-Based Power Combiner

机译:KA带双输入堆叠22nm CMOS FDSOI功率放大器,具有基于变压器的功率组合器

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A Ka-band dual input, three stack power amplifier (PA) is designed and fabricated using 22nm CMOS FDSOI. The PA output matching is implemented with a transformer-based combiner, which allows tuning the load with bias and input drive settings. The PA shows maximum output power, gain, one dB output power compression point (P1dB) and power added efficiency (PAE) of 19.5dBm, 11.5dB, 14.1dBm and 17%, respectively, measured at 29.5 GHz. Measured amplitude to phase modulation (AM-PM) stays at very low level, below 0.7° up to P1dB and below 2.6° up to P3dB. With a 100 MHz 64-QAM OFDM signal the PA achieves 8% error vector magnitude (EVM) and -28dBc adjacent channel leakage ratio (ACLR) at 6.3dBm and 7.6dBm output channel power, respectively.
机译:一个KA带双输入,三个堆叠功率放大器(PA)设计和制造了22nm CMOS FDSOI。 PA输出匹配使用基于变压器的组合器实现,允许用偏置和输入驱动器设置调整负载。 PA显示最大输出功率,增益,一个DB输出功率压缩点(P 1db )在29.5GHz中,分别为19.5dBm,11.5db,14.1dBm和17%的电力增加效率(PAE)。测量到相位调制(AM-PM)的幅度保持在非常低的水平,低于0.7° 1db 低于2.6° 3db 。具有100 MHz 64-QAM OFDM信号,PA分别在6.3dBm和7.6dBm输出通道功率下实现8%的误差矢量幅度(EVM)和-28dbc相邻的信道泄漏比(ACLR)。

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