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A concise multiple scattering method for via array analysis in a circular plate pair

机译:一种简洁的多重散射方法,用于圆板对中的孔阵列分析

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Parallel plate modes are excited by the magnetic frill currents in the via holes (anti-pads). These modes are expressed as cylindrical waves. Multiple scattering of these modes among vias as well as from the edge boundaries of the plate pair are rigorously considered with the addition theorem of the cylindrical waves. An admittance matrix is derived for the via ports at the top/bottom surfaces of the via holes. Good agreement has been found between numerical simulations and the algorithm presented.
机译:平行板模式会受到通孔(抗焊盘)中的磁褶边电流的激励。这些模式表示为圆柱波。通过圆柱波的附加定理,严格考虑了这些模式在通孔之间以及从板对的边缘边界的多次散射。导出通孔顶部/底部表面的通孔导纳矩阵。在数值模拟和提出的算法之间已经找到了很好的一致性。

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