Comparative investigation of plating conditions on self-annealingof electrochemically deposited copper films

摘要

This paper discusses the effects of chemistries and platingconditions on the self-annealing or recrystallization ofelectrochemically deposited copper films. Current density, platingtemperature and the concentrations of the organic additives were foundto strongly affect self-annealing of the copper films. The results showthat copper films deposited at higher current densities, higherconcentrations of organic additives or at lower plating temperaturestake less time to complete self-annealing at room temperature