首页> 外文会议>Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International >Realization and performance of quarter micron feature sizeInGaAs/InP MSM photodetector
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Realization and performance of quarter micron feature sizeInGaAs/InP MSM photodetector

机译:四分之一微米特征尺寸的实现和性能InGaAs / InP MSM光电探测器

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A high-speed quarter-micron feature sizeIn0.53Ga0.47As metal-semiconductor-metal (MSM)photodetector was fabricated on InP for integrated optoelectronicapplications. The photodetector material was grown by molecular beamepitaxy and processed by direct e-beam lithography. The intrinsicdetector is expected to have a 3-dB bandwidth exceeding 60 GHz. Themeasured extrinsic bandwidth limited by parasitic bonding pads andpackage capacitance is approximately 30 GHz. The dark current for thisdetector is 1.0 μA at 1.25 V bias. Without an antireflectiondielectric coating, the photodetector responsivity exceeds 0.15 A/W. Anovel optical mixing technique was used for frequency responsecharacterization of this device
机译:高速四分之一微米特征尺寸 In 0.53 Ga 0.47 作为金属-半导体-金属(MSM) 在InP上制造了用于集成光电的光电探测器 应用程序。光电探测器材料通过分子束生长 外延并通过直接电子束光刻处理。内在的 检波器有望具有超过60 GHz的3 dB带宽。这 测量的外部带宽受寄生键合焊盘和 封装电容约为30 GHz。暗电流为此 检测器在1.25 V偏压下为1.0μA。没有防反射 介电涂层,光电探测器的响应度超过0.15 A / W。一种 新型光学混频技术用于频率响应 该设备的特性

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