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Heteroepitaxial PbTe-Si and (Pb, Sn)Se-Si structures for monolithic 3-5 µm and 8-12 µm infrared sensor arrays

机译:异质外延PbTe-Si和(Pb,Sn)Se-Si结构用于3-5微米和8-12微米单片红外传感器阵列

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Epitaxial layers of narrow gap PbTe and (Pb,Sn) Se have been grown on Si substrates, and used for the first time to fabricate intrinsic photovoltaic IR-sensors on Si for the 3-5µm and 8-12µm range. The narrow gap semiconductors were grown on the BaF2side of a graded (Ca,Ba)F2buffer film which served to overcome the large lattice mismatch (up to 19%) to the Si. The backside illuminated IR-devices revealed resistance area products at 87K of up to 4Ωcm2for PbTe (cut -off wavelength 5.8µm), and up to 0.5Ωcm2for (Pb,Sn) Se with 9.7 µm cut-off. These values come close to or exceed the photon noise limit (for 295K background radiation, 180° FOV, 50% quantum efficiency). The results open up the possibility to construct large monolithic IR-FPA's (focal plane arrays) with IR-sensors in the narrow gap semiconductor and signal processing in the Si.
机译:窄间隙PbTe和(Pb,Sn)Se的外延层已经在Si衬底上生长,并首次用于在3-5μm和8-12μm的范围内在Si上制造本征光伏IR传感器。窄间隙半导体生长在渐变(Ca,Ba)F 2 缓冲膜的BaF 2 侧,该膜可克服较大的晶格失配(高达19% )到Si。背面照明的红外设备显示,对于PbTe(截止波长5.8μm),在87K时的电阻面积积高达4Ωcm 2 ,而对于( Pb,Sn)Se的截止值为9.7 µm。这些值接近或超过光子噪声限制(对于295K背景辐射,180°FOV,50%量子效率)。结果开辟了在窄缝隙半导体中用IR传感器构造大型单片IR-FPA(焦平面阵列)的可能性,并在Si中进行信号处理。

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