Fast frequency domain tools for system analysis of EMI/EMC topologies

摘要

With the increased use of wireless devices and applications, coupling and interference in electronic devices due to either intentional or un-intentional electromagnetic sources is of increased concern. Such sources can cause sufficient disruption to the circuit or chip logic to the point where the functionality and logic state of the electronic device can be altered due to such extraneous sources. In this paper, we employ fast EM algorithms such as the multilevel fast multipole moment method (MLFMM) and the hybrid finite-element boundary-integral (FE-BI) method for the analysis of coupling from external sources into realistic geometries. Specifically, the MLFMM is employed to analyze large-scale problems such as vehicular structures whereas the FE-BI method is used to analyze volumetric structures with dielectric media such as printed circuit boards. In this paper, the method of moments (MoM) accelerated by MLFMM is employed to analyze for the fields within an automobile chassis in the presence or absence of a wire harness and for different aperture sizes. The employed FE-BI method focuses on the analysis of plane wave illumination onto passive circuit geometries such as the microstrip interdigital filter and active circuit topologies like an active microstrip low noise amplifier.