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Emerging FETs for Low Power and High Speed Embedded Dynamic Random Access Memory

机译:用于低功耗和高速嵌入式动态随机存取存储器的新兴FET

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The work reports on the assessment of two emerging devices, namely Tunnel Field Effect Transistor (TFET) and Junctionless Transistor (JLT), for applicability as low power and high speed embedded Dynamic Random Access Memory (eDRAM) at 85 °C. The critical aspect of DRAM functionality being independent gate operation has been realized through twin/dual architecture in TFET and JLT. The first (front) gate primarily controls the read operation based on band-to-band tunneling (TFET) and drift-diffusion mechanism (JLT), whereas the second gate is responsible for charge storage in both the devices. The ability of TFET and JLT with write operation in short time (<; 0 ns) and at low power shows their feasibility for embedded memory applications. TFET is benefited with a high retention time (~350 ms at 85 °C for gate length of 250 nm) while JLT requires further optimization for longer charge sustenance. The concept and insights into device operation highlight the advantages and limitations of devices for eDRAM.
机译:该工作报告评估了两种新兴器件,即隧道场效应晶体管(TFET)和无结晶体管(JLT),适用于85°C的低功耗和高速嵌入式动态随机存取存储器(eDRAM)。通过TFET和JLT中的双/双架构,实现了独立于栅极操作的DRAM功能的关键方面。第一个(前)门主要基于带到隧道(TFET)和漂移扩散机制(JLT)控制读取操作,而第二个门负责这两个器件中的电荷存储。 TFET和JLT在短时间(<; 0 ns)和低功耗下具有写操作的能力表明了它们在嵌入式存储器应用中的可行性。 TFET具有较高的保留时间(对于85 nm的栅极长度为250 nm,约为350 ms的保留时间),而JLT需要进一步优化以获得更长的电荷维持时间。对设备操作的概念和见解突出了eDRAM设备的优点和局限性。

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