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A 0.6V Retention VMIN Ultra-Low Leakage High Density 6T SRAM in 40nm CMOS Technology Using Adaptive Source Bias

机译:采用自适应源偏置的40nm CMOS技术中的0.6V保留VMIN超低漏电高密度6T SRAM

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A low retention Vmin 6T-SRAM is realized in 40nm CMOS technology under source bias condition. A high density (HD), ultra-low leakage (ULL) 6T SRAM cell with an area of 0.242um2 is used. We could reduce the retention Vmin of SRAM array to 0.6V using adaptive source bias scheme. Source bias is applied to achieve ultra-low leakage during standby mode of operation. Source bias results in loss of stability due to reduced effective rail-to-rail voltage of memory cell and hence becomes difficult to reduce the retention Vmin of SRAM. An adaptive source bias scheme is used to apply reduced source bias selectively for low retention noise margin (RNM) conditions. We could reduce the retention Vmin by 100mV to 0.6V compared to 0.7V realized with the conventional scheme. We could reduce the leakage at FF/125°C by 30 percent due to reduction of Vmin from 0.7V to 0.6V. At TT/0.6V/25°C, we could achieve the target leakage of 0.5pA/Cell during standby mode of operation.
机译:在源极偏置条件下,采用40nm CMOS技术实现了低保留Vmin 6T-SRAM。使用面积为0.242um2的高密度(HD),超低泄漏(ULL)6T SRAM单元。我们可以使用自适应源偏置方案将SRAM阵列的保留Vmin降低至0.6V。在待机工作模式期间,施加源偏置以实现超低泄漏。源极偏压由于降低了存储单元的有效轨到轨电压而导致稳定性损失,因此变得难以降低SRAM的保留Vmin。自适应源偏置方案用于为低保留噪声容限(RNM)条件选择性地施加减小的源偏置。与传统方案实现的0.7V相比,我们可以将保留Vmin降低100mV至0.6V。由于Vmin从0.7V降至0.6V,我们可以将FF / 125°C的泄漏降低30%。在TT / 0.6V / 25°C时,我们可以在待机工作模式下实现0.5pA / Cell的目标泄漏。

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