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A Temperature Compensated Read Assist for Low Vmin and High Performance High Density 6T SRAM in FinFET Technology

机译:FinFET技术中用于低Vmin和高性能高密度6T SRAM的温度补偿读辅助

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A low Vmin, 6T-SRAM is realized in 7nm FinFET Technology using read and write assist methods. Read margin of the SRAM cell is recovered using a temperature compensated wordline lowering scheme. This temperature compensated Read Assist provides additional advantage that lowering on wordline is almost process independent that makes Read Assist very robust. This scheme makes design free from tuning after post silicon. Since Proposed Read Assist circuit lowers Wordline at high temperature while lowering at low temperature is very minimal, SRAM writability is not impacted by Read Assist Circuity at low temperature. At low voltage, SRAM performance is limited by Read cycle time. The proposed Read Assist scheme improves Read performance by 200%, which in-turn reflects the gain in operating frequency up to 100%. In the proposed Read assist implementation operating frequency is almost comparable to system when Read Assist is not enabled with added advantage of low voltage enablement
机译:采用读和写辅助方法,采用7nm FinFET技术实现了低Vmin,6T-SRAM。使用温度补偿字线降低方案可恢复SRAM单元的读取裕量。这种具有温度补偿功能的Read Assist提供了额外的优势,即字线上的降低几乎与过程无关,这使Read Assist非常坚固。此方案使设计免于后期硅片后的调整。由于建议的读辅助电路在高温下会降低字线,而在低温下则非常低,因此SRAM的可写性不受低温下的读辅助电路的影响。在低电压下,SRAM的性能受到读取周期时间的限制。拟议的读取辅助方案将读取性能提高了200%,这反过来又反映了高达100%的工作频率增益。在建议的读取辅助实施方案中,当未启用读取辅助功能并具有低压启用的优势时,工作频率几乎与系统相当

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