首页> 外文会议>IEEE Electrical Design of Advanced Packaging and Systems Symposium >Effect of layered media on the parallel plate impedance of printed circuit boards
【24h】

Effect of layered media on the parallel plate impedance of printed circuit boards

机译:分层介质对印刷电路板平行板阻抗的影响

获取原文
获取外文期刊封面目录资料

摘要

This paper evaluates the impact of layered media on the parallel plate impedance of printed circuit boards. In the parallel plate impedance computation using the radial waveguide method (RWM) for infinite planes and a contour integral method (CIM) for finite planes, the layered nature of investigated structures can be accounted for by effective wave numbers. Here, the effective wave numbers are obtained using either an exact solution from the transverse resonance method (TRM) or adopting approximations based on the assumption of quasi-TEM fields and the applicability of suitable averages. The wave numbers obtained with these techniques are compared for typical structures of interest, and the parallel plate impedance computed with effective wave numbers is evaluated and compared to a full wave solution. The results show that a comparatively simple approximation for the effective wave number is sufficient for an accurate parallel plate impedance calculation.
机译:本文评估了分层介质对印刷电路板平行板阻抗的影响。在使用径向波导法(RWM)求解无限平面和使用轮廓积分法(CIM)求解有限平面的平行板阻抗中,所研究结构的层状性质可以通过有效波数来解释。在这里,有效波数是使用横向共振法(TRM)的精确解或通过基于准TEM场的假设和适当平均值的适用性而近似得出的。比较了用这些技术获得的波数与感兴趣的典型结构,并评估了用有效波数计算出的平行板阻抗,并将其与全波解进行了比较。结果表明,有效波数的一个相对简单的近似值足以进行精确的平行板阻抗计算。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号