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Process Development for Laser Powder Bed Fusion of pure Copper

机译:纯铜激光粉末床熔合工艺开发

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This paper describes the development of suitable process parameters to ensure a reproducible, defect-free production ofpure copper specimen via Laser Powder Bed Fusion (LPBF) also called Selective Laser Melting (SLM). Therefore, a setof experiments was developed and evaluated in a Design of Experiment (DoE) which finally provide an indication aboutideal process parameters for melting pure copper powder at a wavelength of 1070 nm. For the experiments Cu-ETP witha copper purity of more than 99.90 % was processed with a laser power of up to 500 W resulting in a maximum density of99.82 % and an electrical conductivity of 56.88 MS/m. Besides the development of optimal parameter combinations oflaser power, laser speed and hatching distance, focusing the laser beam to a spot diameter of about 35 μm with a fusedsilica f-theta lens and thus high laser intensities of about 416 kW/mm² resulted in best materials properties.
机译:本文介绍了合适的工艺参数的开发,以确保可重复生产,无缺陷的生产。 通过激光粉末床熔合(LPBF)也称为选择性激光熔化(SLM)的纯铜样品。因此,一套 实验设计是在实验设计(DoE)中开发和评估的,最终提供了有关 熔化1070 nm波长的纯铜粉的理想工艺参数。对于实验Cu-ETP与 铜纯度超过99.90%的激光功率高达500 W,最大密度为 99.82%,电导率为56.88 MS / m。除了开发最佳的参数组合 激光功率,激光速度和影线距离,将激光束聚焦到约35μm的光斑直径,并进行聚光 二氧化硅f-theta透镜,因此约416 kW /mm²的高激光强度产生了最佳的材料性能。

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