首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >Soft error immune 0.46 μm2 SRAM cell with MIM node capacitor by 65 nm CMOS technology for ultra high speed SRAM
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Soft error immune 0.46 μm2 SRAM cell with MIM node capacitor by 65 nm CMOS technology for ultra high speed SRAM

机译:具有65nm CMOS技术的MIM节点电容器和MIM节点电容器的抗软错误0.46μm 2 SRAM单元,用于超高速SRAM

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摘要

The smallest SRAM cell, 0.46 um2, is realized by a single pitch cell layout, gate poly trim mask technique, 80 nm contact holes formed by polymer attaching process, and a 193 nm ArF lithography process. The MIM (metal-insulator-metal) node capacitor is developed and used for the first time in the SRAM cell to reduce the radiation induced soft error rate, dramatically. The high performance transistors are developed with a channel length of 70 nm, plasma nitrided 13 Å gate oxide, low thermal budget sidewall spacer, and CoSix.
机译:最小的SRAM单元0.46 um 2 是通过单节距单元布局,栅极多晶硅修整掩模技术,通过聚合物附着工艺形成的80 nm接触孔以及193 nm ArF光刻工艺实现的。 MIM(金属-绝缘体-金属)节点电容器被开发出来,并首次在SRAM单元中使用,以显着降低辐射引起的软错误率。开发了具有70 nm沟道长度,等离子氮化的13Å栅极氧化物,低热预算侧壁隔离层和CoSix的高性能晶体管。

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