首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >90-nm-node multi-level AG-AND type flash memory with cell size of true 2 F2/bit and programming throughput of 10 MB/s
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90-nm-node multi-level AG-AND type flash memory with cell size of true 2 F2/bit and programming throughput of 10 MB/s

机译:90 nm节点的多层AG-AND型闪存,单元大小为真正的2 F 2 /位,编程吞吐量为10 MB / s

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The first true 2-F2/bit flash cell with a programming throughput of 10 MB/s was developed. In this cell, diffusion-layer local bit lines of an assist-gate AND-type flash are replaced by inversion-layer ones under assist gates. The bit-line pitch is thus reduced to 2 F. A drain-disturbance-free and soft-write-free flash cell was produced by means of a new diffusion-layer-less technology. Source-side injection programming is applicable to the new flash cell; therefore, the cell programming time is reduced to 1 μs. The smallest memory cell (0.0162 μm2/bit) achieved to date was accomplished by using a 90-nm technology node and applying multi-level cell technology.
机译:开发了第一个真正的2-F 2 / bit闪存单元,其编程吞吐量为10 MB / s。在该单元中,辅助门AND型闪光灯的扩散层局部位线被辅助栅下方的反转层位线代替。因此,位线节距减小到2F。借助于新的无扩散层技术生产了无漏极干扰和无软写入的闪存单元。源端注入编程适用于新的闪存单元;因此,单元编程时间减少到1μs。迄今为止达到的最小存储单元(0.0162μm 2 /位)是通过使用90纳米技术节点并应用多级单元技术实现的。

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