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8 × 8 format InGaAs/InP avalanche photodiode plane array for 3D imaging laser radar system

机译:用于3D成像激光雷达系统的8×8格式InGaAs / InP雪崩光电二极管平面阵列

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This paper reports a planar structure InGaAs/InP avalanche photodetector focal plane arrays. Their material structure useseparate absorption, grading, charge and multiplication layer. The pixel pitch of 8 × 8 format detectors is 250 μm.The breakdown voltage (VBD) is typically in the range of 65 to 70 V for most of the devices on the same wafer. Thetypical dark current at 90% of VBD is 3 nA, dark currents as low as 0.5 nA at 90% of VBD have also been observed forsome diodes, corresponding to a dark current density of 1 × 10~(-5) A/cm~2. The photocurrent starts to increase at the“punch-through” voltage V_p of 43 V. The responsivity at 1.55 μm is 0.91 A/W at unity gain and the multiplication layeris estimated to be 1.2 μm. Each device on the same wafer has excellent characteristics and high uniformity throughmeasurement, laying a solid foundation for 3D imaging laser radar systems.
机译:本文报道了一种平面结构的InGaAs / InP雪崩光电探测器焦平面阵列。它们的材料结构用途 分离吸收,分级,电荷和倍增层。 8×8格式检测器的像素间距为250μm。 对于同一晶片上的大多数器件,击穿电压(VBD)通常在65至70 V的范围内。这 在VBD的90%时典型的暗电流为3 nA,在90%的VBD时也观察到低至0.5 nA的暗电流。 一些二极管,对应于1×10〜(-5)A / cm〜2的暗电流密度。光电流在 43 V的“穿通”电压V_p。在单位增益和倍增层下,1.55μm时的响应度为0.91 A / W 估计为1.2μm。同一晶片上的每个器件都具有出色的特性和很高的均匀性 测量,为3D成像激光雷达系统奠定了坚实的基础。

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