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Influence of bonding on the efficiency of piezoceramic patches as actuators in smart structures

机译:键合对压电陶瓷贴片作为智能结构中促动器效率的影响

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Abstract: In smart and adaptive structures very often piezoceramic elements are used as sensors or actuators. If these elements are used as actuators, an optimized bonding is necessary for a good efficiency of the overall system. In experiments it was observed, that the quality of the bonding depends on several factors. Therefore, a systematic investigation of the problem is given in the present paper both theoretically and experimentally. The main focus of the paper is to elaborate a simple measurement both of the bonding thickness and of the overall coupling efficiency between the piezoceramic element and the elastic structure. In the paper it is shown that by measuring the electric impedance at different frequency bands it can easily be seen if a bonding is good or bad. The experimental results are compared with theoretical models. One of the main results is that the thickness of the bonding layer should be small, because the loss of the electric field in the ceramic due to the additional capacity between actuator and structure is most important if a nonconductive adhesive is used.!19
机译:摘要:在智能和自适应结构中,压电陶瓷元件经常用作传感器或执行器。如果将这些元件用作致动器,则必须进行优化的粘合,以提高整个系统的效率。在实验中观察到,键合的质量取决于几个因素。因此,本文从理论上和实验上对该问题进行了系统的研究。本文的主要重点是阐述粘合厚度以及压电陶瓷元件与弹性结构之间整体耦合效率的简单测量方法。该论文表明,通过测量不同频带上的电阻抗,可以很容易地看出粘结的好坏。将实验结果与理论模型进行了比较。主要结果之一是,粘合层的厚度应较小,因为如果使用非导电粘合剂,则由于致动器和结构之间的附加容量而导致的陶瓷中电场的损失最为重要!19

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