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Influence of bonding on the efficiency of piezoceramic patches as actuators in smart structures

机译:键合对智能结构中的致动器的压电母贴剂效率的影响

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In smart and adaptive structures very often piezoceramic elements are used as sensors or actuators. If these elements are used as actuators, an optimized bonding is necessary for a good efficiency of the overall system. In experiments it was observed, that the quality of the bonding depends on several factors. Therefore, a systematic investigation of the problem is given in the present paper both theoretically and experimentally. The main focus of the paper is to elaborate a simple measurement both of the bonding thickness and of the overall coupling efficiency between the piezoceramic element and the elastic structure. In the paper it is shown that by measuring the electric impedance at different frequency bands it can easily be seen if a bonding is good or bad. The experimental results are compared with theoretical models. One of the main results is that the thickness of the bonding layer should be small, because the loss of the electric field in the ceramic due to the additional capacity between actuator and structure is most important if a nonconductive adhesive is used.
机译:在智能和自适应结构中,通常压电陶瓷元件用作传感器或致动器。如果这些元素用作致动器,则需要优化的粘合,以获得整个系统的良好效率。在实验中,观察到,键合的质量取决于几个因素。因此,在理论上和实验上,本文给出了对问题的系统研究。纸张的主要焦点是在压电陶瓷元件和弹性结构之间阐明粘合厚度和整体耦合效率的简单测量。在本文中,示出了通过测量不同频带处的电阻抗,如果粘接好或坏,可以容易地看到。将实验结果与理论模型进行比较。主要结果之一是结合层的厚度应该很小,因为如果使用非导电粘合剂,由于致动器和结构之间的额外容量,陶瓷中的电场的损失是最重要的。

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