Holographic pattern measuring system and its application todeformation analysis of printed circuit board due to heat of mountedparts

摘要

A new measuring system, the holographic pattern measuring system(HPMS) was developed which is composed of both the techniques ofholography and graphic image processing. It was applied to deformationanalysis of printed circuit boards (PCB) due to heat generated bymounted parts. The HPMS was applied to obtain the 3-dimensional graphicimage pattern of the deformation of the PCB due to thermal stress withan accuracy of 0.1 μm. A comparison was made of the image patternobtained by the HPMS and the thermographic pattern of the PCB surface.The HPMS pattern was different from the thermographic pattern. Theresults showed that the thermal deformation of the PCB could not beestimated from the thermographic pattern