首页> 外文会议>Gate Insulator, 2001. IWGI 2001. Extended Abstracts of International Workshop on >Electronic structure of high-k transition-metal and rare-earth gatedielectrics for aggressively-scaled silicon devices
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Electronic structure of high-k transition-metal and rare-earth gatedielectrics for aggressively-scaled silicon devices

机译:高k过渡金属稀土门的电子结构积极规模化硅器件的电介质

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The transition from thermally-grown SiO2 to alternativegate dielectrics is proceeding in two steps, initially to Si oxynitridealloys, and then high-k dielectrics. The author defines a classificationscheme based on Pauling bond-ionicity that defines three differentamorphous morphologies for non-crystallization gate oxide gatedielectric materials. This approach to local bonding identifies animportant relationship between oxygen atom bonding coordination and i)dielectric constant, ii) stability against chemical phase separation andcrystallization, and iii) stability against hydrophobic chemicaldegradation. A molecular orbital ab initio approach for obtaining thelocal electronic structure at T-M and R-E earth atoms that bond toO-atoms of the elemental or alloy oxide is described. This approachgenerates a universal energy band scheme that is applicable tonon-crystalline as well as crystalline dielectrics. The results of thesecalculations are compared with local density function (LDF) calculationsemploying the local density approximation (LDA). The agreement betweenthese two different methods confirms that the lowest band-gap for T-Mand R-E oxides and oxide alloys are determined by the atomic energystates of the T-M or R-E atom, and its immediate O-atom neighbors,yielding important scaling relations for band-gaps and band-offsetenergies. The results of spectroscopic studies of transition metaloxides, silicates and aluminates are presented. These results establishthe validity of the electronic structure calculations and provide abasis for interpretation of electrical data on device structures. Deviceperformance issues are addressed, and the relationship betweenelectronic structure and ultimate performance limitations of the high-kgate dielectrics in aggressively-scaled silicon devices is discussed
机译:从热生长的SiO 2 过渡到替代 栅极电介质分两步进行,首先是氧氮化硅 合金,然后是高k电介质。作者定义了一个分类 基于鲍林键离子性的方案,定义了三种不同的 非晶态非晶氧化物栅极的形态 电介质材料。这种本地绑定的方法确定了 氧原子键配位与i)之间的重要关系 介电常数; ii)对化学相分离的稳定性和 结晶,以及iii)对疏水化学物质的稳定性 降解。分子轨道从头开始的方法来获得 与T-M和R-E地球原子键合的局部电子结构 描述了元素氧化物或合金氧化物的O原子。这种方法 产生适用于 非晶体以及晶体电介质。这些的结果 计算与局部密度函数(LDF)计算进行比较 采用局部密度近似(LDA)。双方之间的协议 这两种不同的方法证实了T-M的最低带隙 R-E氧化物和氧化物合金是由原子能决定的 T-M或R-E原子的状态,及其紧邻的O原子邻居, 产生重要的带隙和带偏移比例关系 能量。过渡金属的光谱研究结果 提出了氧化物,硅酸盐和铝酸盐。这些结果证明 电子结构计算的有效性,并提供 解释设备结构上的电气数据的基础。设备 性能问题得到解决,并且之间的关系 高k的电子结构和最终性能限制 讨论了大规模缩放的硅器件中的栅极电介质

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