Novel thermal validation metrology based on non-uniform powerdistribution for Pentium(R) III XeonTM cartridge processordesign with integrated level two cache

摘要

This paper presents a novel thermal metrology that is based onnon-uniform power distribution. This metrology has successfully beenused for validating the cartridge thermal design of Pentium(R) III XeonTM processor products with large integrated L2 cache. Thispaper is divided into two parts. In the first part, the methods andmaterials used in thermal metrology development are highlighted.Detailed descriptions of finite element thermal modeling performed todefine the formula and metrology of cartridge thermal resistance as wellas thermal requirements for Pentium(R) III XeonTM cartridgeprocessor design are presented. In addition, illustrations ofappropriate thermal test vehicle design that allows accurate simulationand measurement of non-uniform power distribution and die surfacetemperatures are also included. Measurement capability analysis on theoverall accuracy and stability of thermal metrology is illustrated. Inthe second part, thermal interface material characterization and designvalidation activities, which are carried out using the proposed thermalmetrology during the cartridge technology development, are discussed indetail