A hands-on multi-disciplinary product development course for microsystems packaging education at Georgia Tech

摘要

A cross-disciplinary two-part Design-Build-Operate (DBO) programhas recently been developed by the Packaging Research Center (PRC) atGeorgia Institute of Technology. This program enables undergraduate andgraduate students to gain hands-on experience in design, fabricationprocesses, material systems, electrical testing, flip-chip assembly,thermal management, and reliability assessment. The entire program isoffered in two semesters. The first course, DBO1, covers thefundamentals of substrate fabrication processes and is augmented by aninteractive multimedia education presentation that makes the coursematerial remotely accessible through the Internet. The second course,DBO2, encompasses electronics manufacturing processes, material systems,testing, thermal management and reliability assessment