首页> 外文会议>Electronic Components and Technology Conference, 2001. Proceedings., 51st >Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbpsoptical transmitter and receiver modules
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Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbpsoptical transmitter and receiver modules

机译:内置CSP的TiNxOy薄膜电阻器,可实现10 Gbps光学发射器和接收器模块

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Integral passive components provide efficient circuitminiaturization while maintaining high performance and reducing assemblycosts. The development of practical integral passive components,however, requires advances in the areas of materials, low-costprocesses, and structural design. We have developed new TiNxOy thin-filmresistors, as well as a termination resistor-embedded CSP, and a processfor fabricating integral passive components. Our TiNxOy films exhibit asheet resistivity in the range of 30-5 k 22/square. To keep costs low,we have made the fabrication process compatible with that for MCM-D/L.Resistors as small as 25 μm square have been successfully producedwith this process. The Chip Scale Package (CSP) with embedded resistorshas been designed for 10 Gbps optical transmitter and receiver modules.A fabricated version shows excellent return loss for its terminationresistor, less than -20 dB in the frequency range of 50 MHz -14 GHz, andits resistors performed high reliability in constant voltage stresstests, with less than 5% change in resistance at 800 mW/mm2over 1000 hours
机译:集成的无源元件可提供高效的电路 小型化,同时保持高性能并减少组装 费用。开发实用的集成无源元件, 但是,需要材料,低成本领域的进步 流程和结构设计。我们开发了新的TiNxOy薄膜 电阻器以及端接电阻嵌入式CSP和工艺 用于制造集成的无源元件。我们的TiNxOy膜表现出 薄层电阻率在30-5 k 22 /平方的范围内。为了降低成本, 我们已经使制造工艺与MCM-D / L兼容。 已成功生产出面积仅为25μm的电阻器 这个过程。带有嵌入式电阻器的芯片级封装(CSP) 设计用于10 Gbps的光发射器和接收器模块。 人为制造的版本在终止时表现出出色的回波损耗 电阻,在50 MHz -14 GHz的频率范围内小于-20 dB,并且 其电阻在恒定电压应力下表现出高可靠性 测试,在800 mW / mm 2 时电阻变化小于5% 超过1000小时

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