首页> 外文会议>Electronic Components and Technology Conference, 1993. Proceedings., 43rd >High density integrated circuit design: simultaneous switchingground/power noises calculation for pin grid array packages
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High density integrated circuit design: simultaneous switchingground/power noises calculation for pin grid array packages

机译:高密度集成电路设计:同步切换引脚栅格阵列封装的接地/电源噪声计算

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The author presents basic electrical models to calculateequivalent inductances (noises) for a 179 pin grid array package as afunction of ground/power/signals pin organizations. A full experimentalinductances measurement based on time domain reflectometry and frequencymethod is also presented. A specific test vehicle was elaborated toavoid fixturing noise. Calculated and measured signal effectiveinductance values are compared. Each integrated circuit logic family hasa specific switching point. Thus, adequate ground/power/signalorganization depends on the technology used. For some logic familieslike TTL (transistor transistor logic) and DCFL in silicon and GaAstechnologies, the switching point near the ground voltage indicates thatthe critical path is ground. On other hand, the internal switchingcurrent becomes comparable to the input buffers (30-50 mAs). Thus, theground/signal/power organization of output buffers must take intoaccount the internal logic I/O's (input/outputs). The noises are asfunction of the number of IO buffers and internal logic IO gates
机译:作者介绍了基本的电气模型以进行计算 179针栅格阵列封装的等效电感(噪声)为 接地/电源/信号引脚组织的功能。全面的实验 基于时域反射法和频率的电感测量 还介绍了该方法。精心设计了一种特定的测试工具 避免产生噪音。计算和测量的信号有效 比较电感值。每个集成电路逻辑系列都有 一个特定的切换点。因此,足够的接地/电源/信号 组织取决于所使用的技术。对于某些逻辑系列 像是硅和GaAs中的TTL(晶体管晶体管逻辑)和DCFL 技术,接近接地电压的开关点表明 关键路径是地面。另一方面,内部切换 电流变得可与输入缓冲器(30-50 mA / ns)相提并论。就这样 输出缓冲器的接地/信号/电源组织必须考虑 说明内部逻辑I / O(输入/输出)。噪音是 IO缓冲区和内部逻辑IO门数量的函数

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