Analysis and resolution of vibration induced wire breaks in MQUADcavity packages

摘要

Wire breaks near the second bond in MQUAD packages were found tobe caused by a board depanelling process that used a high speed router.The router caused board vibrations that were transmitted to the internalcantilevered package leads. Reducing the cantilevered lead length, sothat the lead resonant frequency is increased and the lead tipdeflection is decreased effectively eliminates the wire breaks