Reliability and thermal characterization of a 3-dimensionalmultichip module

摘要

Three dimensional packaging extends the high interconnectiondensity which has been achieved using multichip modules to a newdimension. In this paper, we describe the fabrication of an unique3-dimensional multichip module (3-D MCM) based on AT&Ts Si-on-SiMicro Interconnect technology. Four multichip tiles are interconnectedon a multilayer metal-core printing wiring board. Eight such boards arethen stacked vertically to form a 3-D module. Compliant anisotropicallyconductive elastomers are the key element in this design providingelectrical interconnection between the stacked boards. The heatgenerated by the multichip tiles is conducted to the metal-core boardand removed by air forced through holes on the perimeter of the boards.This paper describes results of a reliability evaluation of the verticalinterconnect scheme. In addition a thermal characterization of the 3-Dmodule is presented