Multichip packaging technologies in IBM for desktop to mainframecomputers

摘要

IBM currently manufactures six varieties of multichip module. Theyinclude air-cooled TCMs (thermal conduction modules) based on 63 layersof alumina-molybdenum with surface thin-film wiring, and water-cooledTCMs based on glass-ceramic/copper with thin-film redistribution. Thefour other multichips are all air-cooled and are based on ultradensethin film on silicon, high-density laminated printed wiring multichipwith direct chip attach by flip-chip, and pinned, thin-film metallizedmultichip. The number of chips in these products ranges from 2 to 121,and the applications range from personal computers to mainframes