Polyimide copper thin film redistribution on glass ceramic/coppermultilevel substrates

摘要

The first-level package developed for Models 820 and 900 of theIBM ES9000 system family combines polymide copper thin-film technologywith glass-ceramic technology to provide high wiring density andexcellent electrical performance. The realization of the designapplication of the technology of the IBM ES9000 resulted in thedevelopment of several thin-film technologies for packaging. Some ofthese are: a photolith expose strategy to match the irregular image of asintered ceramic substrate to a regular photolithographic grid; areliable, planar layer interconnection structure based on an applicationof projection laser ablation technology; a novel redundant wiringstructure which provides both high yield wiring and terminal metalstructures; and a comprehensive, reliable repair strategy