Analysis of alignment tolerant hybrid optoelectronic receivers forhigh density interconnection substrates

摘要

High frequency signal distribution in HDI/HDW substrates can beachieved using optical interconnections. To realize effective milli- andmicro-haul interconnections on these substrates, the hybrid integrationof independently optimized interface circuits and optoelectronicdetectors is critical. Further, to realize effective cost goals,designing the optoelectronic interface for alignment tolerance is a keygoal. This paper describes the design, fabrication, and test of hybridintegrated optoelectronic interface circuits designed for alignmenttolerance and for integration onto an HDI/HDW substrate