Network analyzer calibration methods for high-density packagingcharacterization and validation of simulation models

摘要

A diversity of advanced modeling and simulation tools forapplication to packaging and interconnect problems have been developedover the past decade. The development of accurate mixed signal and highfrequency models requires verification and validation using highfrequency measurements. The need for model verification requiresaccurate measurement calibration for good comparison data. This workcompares a variety of calibration methods for use with on-wafer probingand assesses their various advantages and limitations