Applications of newly developed positive photosensitive blockco-polyimides to CSPs

摘要

Meeting the challenging market-defined needs of CSPs (chip sizedpackages) industry requires a new substrate technology that provideshigher I/O densities, higher performance, thinner and lighter packagingstructures than previously available solutions. In this paper, the firstapplications to CSP interposer (CSP-IP) processes by newly developedpositive photosensitive block co-polyimides (PPI), which P I R&DCo., Ltd. of Japan has commercialized recently, are discussed