Novel high dielectric constant nano-structure polymer-ceramiccomposite for embedded capacitor application

摘要

Embedded capacitor technology can improve electrical performanceand reduce assembly cost compared with traditional discrete capacitortechnology. Developing a suitable material that satisfies electrical,reliability and processing requirements is one of the major challengesof incorporating capacitors into a print wire board (PWB).Polymer-ceramic composites have been of great interest as embeddedcapacitor material because they combine the processability of polymerswith the desired electrical properties of ceramics. A novelnano-structure polymer-ceramic composite with very high dielectricconstant (ε_r-100, a new record for the highest reportedε_r value of nano-composite) has been developed in thiswork. High dielectric constant is obtained by increasing the dielectricconstant of the epoxy matrix (ε_r3 as ceramic filler. Thisnano-composite has low curing temperature (<200° C), thus it isMCM-L (multi-chip-module laminate) process compatible. An embeddedcapacitor prototype with capacitance density of 25 nF/cm2 hasbeen manufactured using this nano-composite and spinning coatingtechnology. The effect of composite microstructure on the effectivedielectric constant has been studied. This novel nanocomposite can beused for the integral capacitors as an important component of SOP(system on packaging) technology that is proposed by packaging researchcenter of Georgia Tech