A measurement and simulation study of transmission lines onmicrostrip and stacked-pair structure for high speed signals

摘要

In high frequency transmission, crosstalk toward neighbor linesincreases because of the strong behavior of electric and magnetic field.In this paper, we present a new transmission structure especiallyfocused on the bus between CPU and memory for high frequency range. Andwe confirm the superiority of new structure through measurement andsimulation study in terms of electromagnetic field analysis